CRR Reed Relay
Description
The MEDER CRR Reed Relay Series is a low-profile device made with a ceramic case that exactly matches the thermal coefficient of expansion of the Reed Switch glass and the reed lead to eliminate any potential packaging stress. This reed relay is the smallest in the industry and switches in the billions of operations. This Relay uses no internal solder and has 1 µV typical thermal offset. Measuring only 8.6mm x 4.4 mm x 3.4 mm, the leadless design eliminates skewing of leads and co-planarity issues. Insulation resistance typical to all points is >1014 Ohms.
Features
- Ceramic / thermoset molded package
- Patent pending
- Smallest in the industry
- No lead frame surface mount design eliminates skewing of leads and co-planarity issues
- Available with BGA (Ball Grid Array)
- Internal magnetic shield standard
- Very low profile
- Gold plated leads
- Low thermal offset typical of 1 µV
- TCE matching of all internal components
- Insulation resistance typical of 1014 Ohms
- 3 volt option available
Applications
- Telecommunications
- Test and measurement systems
- Medical applications
Specifications
| Coil Voltage (VDC) | 3 to 5 |
| Coil Resistance (Ohm) | 70 to 150 |
| Contact Form | 1A; 1B |
| Rated Power (W) | 0 to 10 |
| Switching Voltage (VDC) | 0 to 170 |
| Switching Current (A) | 0 to 0.5 |
| Carry Current (A) | 0 to 0.5 |
| Breakdown Voltage (Minimum VDC) | 210 |
| Item no. | Description | Number of contacts | Contact - form | Contact rating W | Switching current A | Switching voltage V | Coil voltage VDC | Coil resistance OHM |
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